How to conduct semiconductor aging testing?
Performing aging tests to replicate the actual on-site stress environment can help reduce failure rates. Aging testing is crucial for ensuring quality control of the production line.
high temperature test chamber
High temperature test chamber, meeting the requirements of adaptability testing for storage, transportation, and usage time of various products, components, and materials in a high-temperature and constant temperature environment. The outer liner of the box is treated with high-quality steel plate spray coating, while the inner liner of the box is made of stainless steel mirror panel (or drawing plate) by argon arc welding, which is resistant to high temperature and silicone pressure. Advanced product control, uniform temperature, safe and reliable, and complete series.
Features
LED display, button type controller, cost saving
Complete series, classic styles, customizable in different sizes and specifications
Unique internal structure and precise control. Special inner liner design with good temperature uniformity
Program control, automatic setting of temperature rise and fall mode
Can be processed according to the type of inner and outer wall processing, meeting special laboratory requirements
Space saving, convenient sample placement and retrieval
No temperature overshoot, meeting precision process requirements
Test standard
GB/T5170.2
IEC60068-3-5
GB/T5170.5
IEC60068-3-6
Specifications
| Inner box volume | 100L | 225L | 408L | 800L | 1000L | ||
| W*H*D (mm） |
within | 400×500 x500 | 500×750×600 | 600x850×800 | 1000×1000x800 | 1000×1000×1000 | |
| outside | 600×1400× 1300 | 700×1650×1400 | 800×1750×1600 | 1200×1900×1650 | 1200×1900×1850 | ||
| Temperature Range | RT+20℃～+200℃、H：RT+20℃～+300℃ | ||||||
| Control accuracy | ±0.5℃ | ||||||
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