Temptronic TPO3500 ThermoChuck is a high and low temperature cold and hot stage for wafer testing at temperature. It is mainly used for wafer testing in the probe table, as well as laser trimming and wafer aging. The temperature range is - 65 ℃ to+200 ℃. The wafer temperature chuck has better electrical performance. It is a 6-inch, 8-inch and 12-inch Wafer Thermal Chuck with high reliability and high accuracy. It can be integrated with manual, semi-automatic and full-automatic probe stations. To meet your parameter test, FA test, RF test, CV measurement and other purposes.