The upgrading and iteration of semiconductor equipment largely rely on key technological breakthroughs in precision components. Among them, electrostatic chucks are a typical segmented component market that plays an important role in multiple stages of semiconductor manufacturing processes.
In advanced large-scale integrated circuit manufacturing processes, there are hundreds of process steps, and wafers need to be transferred back and forth between up to hundreds of process equipment for processing and testing. During the processing, the wafer must be placed very smoothly and firmly on the process equipment.
What is an electrostatic chuck
ESC (Electrostatic Chuck), also known as electrostatic suction cup, is an advantageous technology that uses electrostatic adsorption to replace traditional mechanical clamping and vacuum adsorption methods. It is known as the "invisible hand" for fixing wafers in semiconductor processes and plays an important role in the processing. At present, it is mainly used in ion etching ETCH, ion implantation IMP, physical vapor deposition PVD, and chemical vapor deposition CVD.
Classification of electrostatic chucks
Electrostatic Chuck (ESC) can be divided into Coulomb type and J-R type. The difference between the two is that when high-voltage direct current is applied to the electrostatic chuck, the surface of the ceramic dielectric layer of the Coulomb type electrostatic chuck will generate polarized charges of opposite polarity with the adsorbed product, thereby forming electrostatic attraction to achieve adsorption fixation. The J-R type electrostatic chuck, on the other hand, transfers and aggregates charged ions on the upper surface of the ceramic dielectric layer, forming a strong electric field between the electrostatic chuck and the adsorbed product, thereby achieving adsorption fixation.

Zonglen has years of research and production experience, and the TC200 series has an extended temperature range of -65 º C to+200 º C, low noise, and DC control system. Up to 5 temperature and ramp/soak/cycle thermal cycling devices can be set on the front panel, using LAN, RS232; Optional: GPIB communication interface, no need for liquid nitrogen or any other consumable refrigerant, efficient cooling system, used for reliable, low-temperature testing of hybrid vehicles and other high-power equipment
This system will become the preferred product for major semiconductor manufacturers and laboratories due to its compact cooling unit, minimal footprint, extremely low energy consumption, and low supporting costs.

Some of the content in this article is reproduced from the internet. If there is any infringement, please contact us for deletion. Thank you!