The CP testing site usually consists of three types of core equipment: ATE (Automated Test Equipment), Probe (Wafer Probe), and Probe Card.

The CP testing site usually consists of three types of core equipment: ATE (Automated Test Equipment), Probe (Wafer Probe), and Probe Card.

The precision of selecting aging equipment directly determines the accuracy of test data, compliance with testing regulations, and the level of product quality control.

Semiconductor manufacturing requires extremely high temperature control accuracy, and temperature fluctuations of 0.1 ℃ may lead to wafer scrap. The corresponding temperature control accessory equipment is a key supporting system to ensure process yield.