CP testing refers to the electrical and functional testing of each chip unit (Die) directly on the wafer before it is cut and packaged. This is a "probing" test aimed at identifying and eliminating defective chips as early as possible, avoiding unnecessary subsequent costs. This testing system mainly consists of the following core components:

Test equipment (ATE): Testing various performance indicators of chips through a series of standardized testing programs. Its main components include:
·Test head: In direct contact with the chip, it executes specific testing tasks.
·Test program: downloaded from the server by the workstation and executed locally.
Probe station: responsible for accurately positioning the wafer for precise testing by the testing machine. The probe station accurately aligns the probes on the probe card with the test pads on the crystal circle through operation, ensuring smooth signal transmission.
Probe Card: It can be regarded as a pipeline connecting the testing machine and the wafer. The probes on it contact the test pads on the wafer and transmit electrical signals to the chip. Probes are usually made of high-quality conductive materials to ensure the effectiveness of signal transmission.
Needle testing interface board and needle tower: These two combine to form a complete signal circuit, allowing electrical signals to be transmitted from ATE to probes and then to the wafer.
Chuck: It fixes the position of the wafer, firmly and accurately maintaining it in the correct position for effective diagnosis by the testing machine.
CP testing uses probe cards to transmit electrical signals to each chip unit and measure its electrical performance through testing equipment. The test items usually include basic electrical performance parameters such as threshold voltage (Vt), on resistance (Rdson), leakage current (Idss), etc. All parts work closely together, like a complete physical examination process, to ensure that each chip passes strict testing procedures and provides high-quality "healthy" chips for downstream production processes. Through such systematic testing, factories can significantly reduce production defects and ensure product quality.

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